PEELABLE MASKA lot of „temporary masks“ is used in PCB´s production process and their mounting. Properties of these masks vary significanty depending on their purpose. Typical function of these masks is connector protection against plating or soldering. Some products may be removed by chemicals or mechanicaly by mask peeling.
Product specification: SD 2955/30
Aplication: protection of Au plated conductors, switches at wave soldering or HAL method, switches and conductor from thick-layer polymers protection during tinning, for protection from component mounting damage (reflow), for specially plated holes protection during soldering.
Specification: peelable mask overlap over covering area > 1,0 mm, peelable mask distance from closest soldered area > 1,0 mm, biggest hole diameter of 2,0 mm
Filling paste (hole filler) serves for burried via filling in HDI / SBU aplications. Paste can be aplicated through design or by screen printing method.
Product specification: PP 2795 SD
Aplication: hole is completely filled with non-conductive paste, serves for burried via filling, for protection of solder leaking to board´s component side
Specification: Filled hole diameter depends on "ASPECT RATIO”
Carbon paste is screen printing conductive coating for keyboards and contacts. The varnish is based on carbon and can be easily applied on copper surface thanks to high solid elements content. Thick layer is coated with single application. It´s wear resistant due to high surface rigidity. Varnish resistance is 14 to 20 W / cm, on dry layer thickness of 25 μm. Typical coated layer thickness is 15 - 30 μm.
Product specification: SD 2843 HAL
Aplication: keyboards, switches
Specification: carbon/carbon distance min. 100 μm, carbon/carbon overlap min. 400 μm