MDI Micromirror digital imagingStandard soldermask exposition method involves film matrix exposition on foto-sensitive matherial on the power circuit board surface. This matrix must be separately created for every printed circuit board layer and must meet all important requirements for proper positioning and high quality resolution at complex prited circuit boards. There can be for example around 8 16 matrixes at technologically complex printed circuit boards. Whole this process can be replaced by single step called direct imaging where the fotosensitive film is exposed by energetic source and system desides which part of the board is exposed and which part is left without energetic dose. Maximal resolution of exposition in the real time is secured by chips with digital micro-mirrors which are capable to change their positions at max. 19 000 Hz frequency. This informations come from CAM data and transfer the digital pattern to future conductive pattern. The source of exposition are lasers, LED or diodes. This device uses UV-LED source for exposition emitioning on two wavelength of 365 nm and 385 nm.
Back to news list