PPT Trenčianská Teplá
Gold is an ideal element for top PCB cover. Given that gold doesn´t form oxides, the temperature and storage conditions have nearly no effect on its durability or condition compared to other finishes. Excellent adhesion is result of practically instant dissolution of gold into the solder. Nickel layer needs to be coated between copper and gold layers to prevent their mixing and therefore causing problems with soldering. This finish is suitable for AI wire bonding.