High Density Interconnector
Never-stopping electro technical industry development sets greater fitting components integration demands every day. This requirements needs to be applied even in PCB production.
In the area where connector and isolation width minimization is no longer an option more integration possibilities needs to be exploited in the form of blind and buried vias and progressive lamination. This brings us greater plug-in options together with PCB size minimization.
HDI (High Density Interconnector) – high density wiring on common substrate or board area.
SBU (Sequential Build-Up) – sequential lamination
Blind holes (Blind via) – vias connecting outer layer with inner
Buried holes (Blind via) – vias connecting inner layers only
Micro holes (Micro via) – holes with diameter 0,2 mm and less
Blind via DPS
Blind via – these holes creates connection between outer layer and selected inner layer. An important limitation is a condition called ASPECT RATIO max. 1:1. If the blind drilling is applied at DPS sequential lamination system, blind via is covered with outer layer and becomes buried via.
Buried via DPS
Buried via – provide connection between two or more inner layers – ASPECT RATIO is max. 1:10. Buried vias are drilled as a standard go-through holes to respective core (this core can be created by several inner layers compression) and the hole is “buried” inside PCB by subsequent outer layers compression.
Stacked via DPS
Stacked vias – in the case of ASPECT RATIO > 1:1 blind via requirements, progressive drilling method can be applied. This procedure assumes that each partial drilling has ASPECT RATIO max. 1:1.